发明名称 |
Board-level EMI shield with enhanced thermal dissipation |
摘要 |
A substrate having at least one electrical component disposed thereon; a plurality of discrete electrically conductive fastening units disposed in a pattern on the substrate surrounding the at least one electrical component; a board-level electromagnetic interference (EMI) shield comprising an electrically conductive layer; a plurality of apertures formed in the board-level EMI shield such that the apertures correspond to the pattern of the electrically conductive fastening units; with at least one thermally conductive interface (TCI) material disposed over the at least one electrical component; and wherein the electrically conductive layer of the board-level EMI shield is in electrical contact with at least one electrically conductive fastening unit.
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申请公布号 |
US2003193794(A1) |
申请公布日期 |
2003.10.16 |
申请号 |
US20020120251 |
申请日期 |
2002.04.10 |
申请人 |
REIS BRADLEY;CANDY WILLIAM |
发明人 |
REIS BRADLEY;CANDY WILLIAM |
分类号 |
H01L23/552;H05K7/20;H05K9/00;(IPC1-7):H05K9/00 |
主分类号 |
H01L23/552 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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