摘要 |
A cathode cartridge N for an electroplating tester includes a cathode conductor <bold>10 </highlight>that conducts electricity to a surface Wa to be plated of a silicon wafer W as an object to be plated, a first insulator <bold>20 </highlight>that covers a front side (the surface Wa to be plated) of the silicon wafer W and holds the cathode conductor <bold>10, </highlight>and a second insulator <bold>30 </highlight>that covers a back side (reverse to the surface Wa to be plated) of the silicon wafer W and holds the silicon wafer W. Negative portions other than the surface Wa to be plated of the silicon wafer W are insulated from plating solution with a first O-ring <bold>22 </highlight>fitted in the first insulator <bold>20 </highlight>and a second O-ring <bold>32 </highlight>fitted in the second insulator <bold>30. </highlight>
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