发明名称 |
Robust leaded molded packages and methods for forming the same |
摘要 |
A method for making a flip chip in a leaded molded package is disclosed. In some embodiments, the method includes using a leadframe structure including a die attach region and leads. The die attach region includes depressions proximate the inner portions of the leads, and an aperture in the die attach region. A semiconductor die is mounted to the die attach region. A molding material passes through the aperture and covers the first surface of the semiconductor die and the die attach region.
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申请公布号 |
US2003193080(A1) |
申请公布日期 |
2003.10.16 |
申请号 |
US20030413668 |
申请日期 |
2003.04.14 |
申请人 |
CABAHUG ELSIE AGDON;GESTOLE MARVIN R.;TUMULAK-RIOS MARGIE S.;MONTAYRE LILITH U.;MANATAD ROMEL N. |
发明人 |
CABAHUG ELSIE AGDON;GESTOLE MARVIN R.;TUMULAK-RIOS MARGIE S.;MONTAYRE LILITH U.;MANATAD ROMEL N. |
分类号 |
H01L23/495;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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地址 |
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