| 摘要 |
A photosensitive resin composition comprising an oxygen sensitizer and a polyamic acid or a polyimide which has substituents having a cis-diene structure at the side chains; a printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device prepared by coating the substrate with the composition and forming fine patterns by exposure of irradiation; and processes for producing a printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device which comprise coating the substrate with the composition and forming fine patterns by crosslinking the cis-diene group by polycondensation with oxidation with the singlet oxygen generated by exposure of irradiation to the oxygen sensitizer in the presence of oxygen. The photosensitive resin composition of the negative type exhibits high sensitivity and high resolution, can form a resin layer having excellent heat resistance and can be applied to production of semiconductor devices and circuit wiring boards. The printed wiring board, the substrate for disposing semiconductor chips and the semiconductor device can be obtained by using the composition. The processes provide the printed wiring board, the substrate for disposing semiconductor chips and the semiconductor device.
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