发明名称 |
METHOD AND APPARATUS FOR STACKING MULTIPLE DIE IN A FLIP CHIP SEMICONDUCTOR PACKAGE |
摘要 |
A semiconductor package is disclosed where the package includes a first die mounted to first surface of a second die. The first surface of the second die is then mounted to a substrate. The substrate includes a hole of appropriate size to receive the first die and to allow the second die to be mounted to the substrate using conventional interconnection and assembly techniques. |
申请公布号 |
WO03085737(A2) |
申请公布日期 |
2003.10.16 |
申请号 |
WO2003US08716 |
申请日期 |
2003.03.21 |
申请人 |
INTEL CORPORATION (A DELAWARE CORPORATION) |
发明人 |
BARRETT, JOSEPH |
分类号 |
H01L21/56;H01L25/065;H01L25/18 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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