发明名称 |
MULTI-LAYER CIRCUIT ASSEMBLY AND PROCESS FOR PREPARING THE SAME |
摘要 |
A process for fabricating a multi-layer circuit assembly is provided. The process generally comprises:(a) providing a perforate electrically conductive core having a via density of 500 to 10,000 holes/square inch (75 to 1550 holes/square centimeter);(b) applying a dielectric coating onto all exposed surfaces of the electrically conductive core to form a conformal coating on all exposed surfaces of the electrically conductive core;(c) ablating the surface of the dielectric coating in a predetermined pattern to expose sections of the electrically conductive core;(d) applying a layer of metal to all surfaces to form metallized vias through the electrically conductive core; and(e) applying a resinous photosensitive layer to the metal layer.The multi-layer circuit assemblies produced by the process, having high via density and thermal coefficients of expansion, are also provided. |
申请公布号 |
WO02073685(A3) |
申请公布日期 |
2003.10.16 |
申请号 |
WO2002US03488 |
申请日期 |
2002.02.05 |
申请人 |
PPG INDUSTRIES OHIO, INC. |
发明人 |
STURNI, LANCE C.;OLSON, KEVIN C. |
分类号 |
C09D5/44;H01L21/48;H01L23/14;H05K1/05;H05K3/00;H05K3/38;H05K3/42;H05K3/44;H05K3/46 |
主分类号 |
C09D5/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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