| 摘要 |
<p>A thin-film forming device, wherein vacuum tanks having a plurality of film forming chambers are installed on different planes and allowed to communicate with each other through vacuumed exchange chambers, and a substrate is exchanged between the vacuum chambers by a substrate exchange mechanisms installed in the exchange chambers, whereby the number of chambers in the thin-film forming device can be easily increased, an area for installation can be reduced, and a production efficiency can be increased.</p> |
