| 摘要 |
A replacement method for a substrate, comprising the steps of, when the substrate is exchanged between a substrate exchange head for receiving the substrate and a carrier from a thin-film forming device and a stage for placing the substrate thereon, receiving the carrier together with the film-formed substrate from the substrate exchange head, delivering only the substrate to the stage while holding the carrier, cooling the held carrier in the held state, receiving, by using the held carrier, the substrate before film formation placed on the stage, and delivering the substrate and the carrier to the film forming device through the substrate exchange head, whereby the temperature of the carrier can be controlled to suppress the rise of temperature of the substrate in a thin-film forming process using the carrier for holding the substrate at the time of film formation.
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