| 摘要 |
PROBLEM TO BE SOLVED: To provide a resist removing agent which can remove a resist after a tin plating film is formed on copper without inducing re-crystallization of tin on copper. SOLUTION: The resist removing agent is prepared as an alkali aqueous solution containing at least a heterocyclic compound having the structure expressed by formula (1) in the molecule as an additive. The solution prevents re-crystallization of tin on copper caused by copper ions dissolving in the resist removing agent. COPYRIGHT: (C)2004,JPO |
