| 摘要 |
PROBLEM TO BE SOLVED: To eliminate a problem occurring when measures are taken in order to repair an uplift of building materials bonded to a substrate by a bonding means such as a tape, from the substrate due to insufficient bonding, the measures being carried out by injecting an adhesive into the uplift, temporarily fixing the uplift by some means, and canceling the temporary fixture of the uplift after the adhesive is cured or dried. SOLUTION: There is provided a new method for repairing the lift, according to which a sheet base having a continuous cavity is inserted into a gap between the substrate and the uplift of the building material, and hardening accelerator is penetrated and held in the sheet base, followed by penetrating anαcyanoacrylate adhesive into the sheet base. Then, theαcyanoacrylate adhesive is hardened while the uplift is pressed from the side of a surface of the building material. In this manner, the uplift is repaired in a short period of time. COPYRIGHT: (C)2004,JPO
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