Heat sink with multiple surface enhancements

摘要

A heat sink (30) for cooling electrical or electronic devices (46) comprises a base plate (32) having a top surface (34) and a bottom surface (36) for attaching to the electronic device (46). At least two vertical plates (38) are affixed to and extend substantially perpendicularly from the top surface (34) in a spaced apart manner and are parallel one to the other. A secondary fin (42) is affixed to and extends between an upper portion of the vertical plates (38). The secondary fin (42) has a top convoluted edge (37) and a bottom convoluted edge (45) and is oriented such that the bottom convoluted edge (45) faces the top surface (34) of the base plate (32). The secondary fin (42) includes a plurality of individual fins (43) formed in a convoluted accordion-like manner. The plurality of individual fins (43) define a plurality of secondary fin passageways (39) between adjacent ones of the individual fins (43) wherein each secondary fin passageway (39) extends from the top convoluted edge (37) to the bottom convoluted edge (45).