| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface analyzing system which includes both an integrating optical device and an individual feature measuring device in one system. <P>SOLUTION: As the integrating optical device, there is a scatterometer or the like, and as the individual feature measuring device, there is a beam imaging system such as a scanning probe microscope, a scanning electron microscope or the like. In a preferred embodiment, the two devices can characterize a wafer held on a common stage. The stage can be variably displaced as prescribed so that the same region of the wafer is characterized by the scatterometer of one position of the stage, and can be characterized by the scanning probe microscope or the beam imaging system. The scatterometer quickly measures the wafer and decides whether there is a problem or not. The scanning probe microscope can detailed measure the wafer in which a flag is stood by the scatterometer. <P>COPYRIGHT: (C)2004,JPO |
