Cutting device for wire bonder

摘要

The device (81) has a blade (86) that can be moved with a component of motion perpendicular to the surface of a substrate and hence of a bonded contact. The blade is mounted so as to be able to give to a limited extent relative to the component of motion perpendicular to the substrate surface so that the force acting on its cutting edge when the blade contacts the substrate is limited to a defined peak value.