| 摘要 |
PROBLEM TO BE SOLVED: To provide a vacuum deposition device which can reduce working time of film deposition without deteriorating the quality of the film deposition. SOLUTION: This vacuum deposition device comprises: an evacuation means to form vacuum atmosphere inside the vacuum deposition device; first and second vapor deposition means to heat-evaporate a vapor deposition material, and deposit the material on a material to be deposited; a control means to perform control so that one vapor deposition means deposits vapor on the material to be deposited, and the other vapor deposition means heats the vapor deposition material preliminarily in the meantime; and a vapor deposition restriction means which is arranged so as to divide the first and second vapor deposition means, and restricts the movement of a gas relatively to the material to be deposited, where the gas is generated by the vapor deposition means which performs the preliminary heating. COPYRIGHT: (C)2004,JPO
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