| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a heat-treating apparatus for thick-film printed circuit boards and a carrier roller that can perform appropriate heat treatment on the front and rear of a substrate where a thick-film material paste is printed, and do not cause inconveniences such as the meandering of the substrate in transport. <P>SOLUTION: A pair of guide members 50 are provided on a plurality of transport rollers 32 that are arranged in parallel one another and are rotated and driven around each axis center by sharing the rotary axis center with the transport rollers 32. Therefore, the substrate 20 is supported on a rotor- shaped body section 52 in the pair of guide members 50 at the edge section for transportation without causing the rear to come into contact with the transport rollers 32. Additionally, the pair of guide members 50 are provided with an annular projection 54 for preventing the meandering of the substrate 20, so that an advance direction is corrected by the annular projection 54 when the substrate 20 nearly meanders. <P>COPYRIGHT: (C)2004,JPO</p> |
