发明名称 SPUTTERING SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a sputtering system which improves productivity by improving the use efficiency of a target. SOLUTION: This sputtering system includes: a target 20 which is opposed to and spaced from a substrate holder 10a, has a rectangular and flat plate form, and has an elliptic arc-shaped projecting part 20aa added to both ends in a rectangular longitudinal direction; a magnet unit structure 32 opposed to and spaced from the rear side; a mounting member 34 and a plurality of magnet units 36 attached to the member 34; and a movement mechanism 38 to move the mounting member 34 reciprocately. Each end of the mounting member 34 includes: an elliptic arc-shaped yoke 36c set to be correspondent to an erosion region for the target 20; outer circumference magnets 36b formed along the outer circumference of the yoke 36c; and the magnet units 36 including central magnets 36a having a reverse polarity to the outer circumference magnets provided in the vicinity of the central part of the yoke 36c. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003293130(A) 申请公布日期 2003.10.15
申请号 JP20020096142 申请日期 2002.03.29
申请人 ANELVA CORP 发明人 TAKAHASHI NOBUYUKI
分类号 C23C14/35;H01J37/34;H01L21/285;(IPC1-7):C23C14/35 主分类号 C23C14/35
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