| 摘要 |
PROBLEM TO BE SOLVED: To reliably form a region having no film deposition in a substrate central part when depositing a specific film for an optical disk, or the like, by a sputtering method, and to improve a distribution of film thickness, or the like, in a film deposition region. SOLUTION: An inner mask to cover the substrate central part is supported by a bearing which is formed at a backing plate on the reverse face of the target, and is further brought into contact with the substrate with a predetermined load by a spring. According to this configuration, the inner mask in the contact state with the substrate also rotates together with the substrate when a thin film is deposited, thereby the distribution of the film thickness is improved. COPYRIGHT: (C)2004,JPO
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