| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic part-sealing device capable of withstanding reflow at high temperatures and an electronic part-sealing device sealed with the subject resin composition and having high reliability in PCT test. SOLUTION: The resin composition for sealing comprises (A) an epoxy resin, (B) a phenol resin, (C) 0.1-10.0 wt.%, preferably 0.5-5.0 wt.% polyvinylcarbazole and (D) 70-95 wt.% inorganic filler, respectively based o the whole of the resin composition, as essential components. The electronic part-sealing device is obtained by sealing an electronic part with a cured product of the sealing resin composition. COPYRIGHT: (C)2004,JPO
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