发明名称 HEAT-SEALABLE RESIN COMPOSITION, FILM USING THE SAME AND LAMINATE
摘要 <P>PROBLEM TO BE SOLVED: To provide a heat-sealable resin composition which can be used as a sealant having a heat seal strength enough to protect the contents in a container made of a polystyrene resin and can be remarkably reduced in cost; and a film made thereof. <P>SOLUTION: This heat-sealable resin composition comprises 100 pts.wt. polyolefin resin and 0.01-5 pts.wt. styrene polymer having a weight average molecular weight, measured by gel permeation chronatograply, of 1,000-40,000 and at least one epoxy group in its molecule. The composition is used for preparing a film and a laminate. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2003292691(A) 申请公布日期 2003.10.15
申请号 JP20020099838 申请日期 2002.04.02
申请人 TOSOH CORP 发明人 KODA SHINGO;DEGUCHI SEI
分类号 B65D53/00;B32B27/00;B32B27/30;B32B27/32;C08J7/00;C08L23/00 主分类号 B65D53/00
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