PAPER SUBSTRATE FOR MOLDING

摘要

PROBLEM TO BE SOLVED: To provide a paper substrate moldable at <60°C processing temperature without requiring preheating during pressurized air molding or vacuum molding, easily carrying out disposal treatment or recycling and utilization and having environmentally excellent properties. SOLUTION: The paper substrate having≥6 and≤16 mm extent of deformation when pressurized just before bursting by using a bursting strength tester defined by JIS P 8131 is used. Furthermore, the paper substrate having≥15 and <50% tensile breaking elongation in the longitudinal direction and≥15 and <50% tensile breaking elongation in the transverse direction defined by the JIS P 8113 is used. COPYRIGHT: (C)2004,JPO