| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a sputtering target with which the adhesion of particles to a substrate can be suppressed in the case where a sputtering target made of easily oxidizable copper is used, and also to provide a manufacturing method therefor. <P>SOLUTION: The sputtering target has a backing plate 10, a copper target 12 provided on the backing plate 10, and a protective layer 14 composed of a corrosion-resisting metal and formed on the surface of the copper target 12. <P>COPYRIGHT: (C)2004,JPO</p> |
