发明名称 PHOTOSENSITIVE COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a negative photosensitive composition which can form a resist film having excellent dry etching durability and hardly producing cracks when a pattern is formed. <P>SOLUTION: The negative photosensitive composition comprises: (A) a polyorganosiloxane resin containing an oxiranyl group or an oxetanyl group; (B) an alkali-soluble polyorganosiloxane resin containing an oxiranyl group or an oxetanyl group and containing a carboxyalkyl group or a hydroxyphenyl group; (C) a polyorganosiloxane resin having a hydroxyl group; and (D) a compound which generates acid by electromagnetic rays or heat. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2003295455(A) 申请公布日期 2003.10.15
申请号 JP20020093594 申请日期 2002.03.29
申请人 SUMITOMO CHEM CO LTD 发明人 YAHAGI AKIRA
分类号 G03F7/075;C08G85/00;G03F7/26 主分类号 G03F7/075
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