RESIN CONTAINING DIELECTRIC FILLER FOR FORMING BUILT-IN CAPACITOR LAYER OF PRINTED CIRCUIT BOARD, DOUBLE-SIDE COPPER CLAD LAMINATED BOARD HAVING DIELECTRIC LAYER FORMED BY USING THE RESIN, AND METHOD FOR PRODUCING THE LAMINATED BOARD

摘要

PROBLEM TO BE SOLVED: To provide a double-side copper clad laminated board for forming a built-in capacitor layer, having a dielectric layer having a film thickness arbitrarily controllable without using a skeleton material and having high strength. SOLUTION: A dielectric filler-containing resin for forming the built-in capacitor layer of a printed circuit board is produced by mixing a binder resin composed of 20-80 pts.wt. of an epoxy resin (including a hardener), 20-80 pts.wt. of an aromatic polyamide resin soluble in a solvent and an arbitrary amount of a cure accelerator to be added when necessity with a dielectric filler comprising a powdery dielectric material having a nearly spherical perovskite structure with an average particle diameter DIA of 0.1-1.0μm, a weight-cumulative particle diameter D50of 0.2-2.0μm measured by laser diffraction scattering particle size distribution measurement and a coagulation degree (D50/DIA) of≤4.5. COPYRIGHT: (C)2004,JPO