| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid sealing resin composition having low stress, excellent in adhesive strength and to provide a semiconductor device. SOLUTION: The liquid sealing resin composition comprises a silicone modified liquid epoxy resin, a liquid polyphenol, an imidazole derivative in microcapsule and an inorganic filler, and the silicone modified liquid epoxy resin is obtained by heating and reacting (a) an epoxy resin and (b) bisphenols in molar ratio (a/b)=1 to 10. The semiconductor device is obtained by sealing a semiconductor element with the liquid sealing resin composition. COPYRIGHT: (C)2004,JPO |
