发明名称 GAS TEMPERATURE CONTROL APPARATUS FOR CHAMBER OF BONDING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a temperature control apparatus for a liquid crystal display bonding chamber of a manufacturing device. SOLUTION: This temperature control apparatus is characterized in that it is provided with a bonding chamber bonding a first substrate and a second substrate applied with a sealing compound, an upper stage and a lower stage disposed in the upper and lower sides of the bonding device chamber, a vent pipe for introducing air or gas into the bonding chamber after the bonding chamber is under vacuum, and a heating means for heating the air or gas introduced through the vent pipe. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003295150(A) 申请公布日期 2003.10.15
申请号 JP20030074961 申请日期 2003.03.19
申请人 LG PHILLIPS LCD CO LTD 发明人 LEE SANG SEOK;PARK SANG HO
分类号 G02F1/13;G02F1/1333;G02F1/1339;G05D23/19;(IPC1-7):G02F1/13;G02F1/133 主分类号 G02F1/13
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