| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a small-sized image pickup module having parts such as an IC and lenses packaged with a substrate and a case has plastic lenses deformed by heat of a reflow furnace and cannot be mounted on a circuit board by reflow of a solder. SOLUTION: A base part 6a of a lens 6 is put on a shelf 2a on an inside wall of a case 2, and an elastic spacer 31 is arranged on the lens, and an elastic ring 32 is arranged in the outer periphery of the lens. Thermal expansion of the lens caused by heating in the reflow furnace is absorbed by compression of these elastic members, so that the lens is not unnaturally deformed and is restored to an original state at a normal temperature. In other examples, a structure of receiving the lens on a conical seat and converting deformation in the diametral direction to that in the axial direction to absorb the deformation by the elastic spacer, a structure of providing projections on the upper face and the outer periphery of the lens to avoid deformation of the lens main body, or a structure of giving elasticity to a shelf part of the case supporting the lens to absorb deformation of the lens may be adopted. Thus the small-sized image pickup module can be mounted by reflow. COPYRIGHT: (C)2004,JPO
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