Method of preventing cracking in optical quality silica layers

摘要

A method is disclosed for making an integrated photonic device having buffer, core and cladding layers deposited on the front side of a wafer. A thick tensile stress layer is deposited on the back side of the wafer just prior to performing a high temperature thermal treatment above 600 DEG C on the cladding layer to prevent the cracking of the layers as a result of the thermal treatment. <IMAGE>