发明名称 LEISTUNGSELEKTRONIK-BAULEMENT MIT VERBESSERTEN THERMISCHEN EIGENSCHAFTEN
摘要 A power electronics component having a housing a cover plate and an electrically active region. The electrically active region is disposed in the housing in such manner that a gap exists between the electrically active region and the inner wall of the housing. The gap is filled with a moisture absorbent bulk granular material.
申请公布号 AT251331(T) 申请公布日期 2003.10.15
申请号 AT20000929283T 申请日期 2000.04.07
申请人 EPCOS AG 发明人 VETTER, HARALD
分类号 H01G4/224;H01G2/12;H01L23/00;H01L23/373;H01L23/42;(IPC1-7):H01G2/08;H01G2/02 主分类号 H01G4/224
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