Substrate with preferably transferable layers and/or surface structures, process for its preparation and the use thereof

摘要

In substrates with preferably transferable structurized and/or unstructurized layers (A) and/or surface structures (B), (A) are applied to or in a lacquer layer (C), which is thermoplastic at this stage, and/or (B) is produced by copying a matrix in (C) under pressure and temperature and/or by embossing, then (C) is stabilized. An Independent claim is also included for production of these substrates by preparing a carrier substrate, coating this with lacquer layer (C), applying layers (A), optionally producing structures (B) and stabilizing (C).