| 发明名称 |
Method for forming a relief image using a very thick photoresist layer on a semiconductor wafer and metal plating method |
| 摘要 |
Photoresist compositions and methods suitable for depositing a very thick photoresist layer in a single coating process are provided. Such photoresist layers are particularly suitable for use in chip scale packaging. |
| 申请公布号 |
EP1353228(A1) |
申请公布日期 |
2003.10.15 |
| 申请号 |
EP20030252227 |
申请日期 |
2003.04.09 |
| 申请人 |
SHIPLEY CO. L.L.C. |
发明人 |
FORMAN, ROBERT S.;STEEPER, JILL E.;HUENGER, ERIC C. |
| 分类号 |
G03F7/00;G03F7/32;C25D5/02;G03F7/027;G03F7/16;G03F7/40;H01L21/027;H01L21/288;H01L21/60;(IPC1-7):G03F7/16;H01L23/485 |
主分类号 |
G03F7/00 |
| 代理机构 |
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| 主权项 |
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