| 摘要 |
PROBLEM TO BE SOLVED: To provide a one-part epoxy resin composition having excellent shape retaining properties after coating an carrying out miniaturizing or high-density loading of semiconductor parts by realizing local sealing such as connected parts of a semiconductor device. SOLUTION: The one-part epoxy sealing resin composition consists essentially of (A) an epoxy resin, (B) an epoxy resin amine adduct curing agent having≥60 and≤100°C melting point, (C) particles of a metal oxide having≤30 nm average particle diameter and≥50 m<SP>2</SP>/g specific surface area as a viscosity modifier and (D) a filler. The sealed semiconductor device is obtained by locally sealing the device with the resin using the composition. COPYRIGHT: (C)2004,JPO
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