| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition imparting a printed circuit board material excellent in dielectric properties, molding properties, heat resistance, etc., and to provide a laminated plate and printed-circuit board comprising the same. SOLUTION: The thermosetting resin composition comprises an epoxide of a polyphenylene ether oligomer having 700-3,000 of number average molecular weight and epoxy groups on both terminals, and a hardener and the laminated plate and the printed-circuit board using the same. COPYRIGHT: (C)2004,JPO
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