发明名称 HOT-MELT ADHESIVE
摘要 PROBLEM TO BE SOLVED: To provide a hot-melt adhesive retaining its adhesive force and flexibility and having high heat resistance. SOLUTION: The hot-melt adhesive comprises (D) a copolymer with an aromatic vinyl monomer (d1), an aliphatic or alicyclic unsaturated hydrocarbon (d2) and/or a 4-24C alkyl or alkenyl (meth)acrylate (d3) as the essential constituent monomers and (E) a (co)polymer having a glass transition temperature (Tg) at least 10°C higher than that of the copolymer D and having an aromatic ring-containing monomer as the essential constituent monomer. The hot-melt adhesive has a melt viscosity (Pa.s; JIS K7117-1987) of 6.1-100 at 140°C. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003292919(A) 申请公布日期 2003.10.15
申请号 JP20030021987 申请日期 2003.01.30
申请人 SANYO CHEM IND LTD 发明人 SHIMADA TETSUYA;KAWAKAMI TAKANORI
分类号 B32B27/00;B32B27/32;C09J109/00;C09J123/00;C09J125/08;C09J133/00;C09J153/02;C09J157/02;(IPC1-7):C09J125/08 主分类号 B32B27/00
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