| 摘要 |
PROBLEM TO BE SOLVED: To improve heat conduction between a heat sink and a heating device. SOLUTION: The heat sink includes at least one heat sink fin 306 with an opening 602. The opening 602 is sized to fit a thermal device 304 when the thermal device 304 is at a first temperature, while the at least one fin 306 is at a second temperature, with the second temperature being higher than the first temperature. COPYRIGHT: (C)2004,JPO
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