PRETREATMENT METHOD FOR ELECTROPLATING STOCK

摘要

PROBLEM TO BE SOLVED: To form a plating film which has excellent adhesive strength when a resin molding having a high residual internal stress is used as a plating stock. SOLUTION: A molding is treated with an acid or an organic solvent, and is thereafter contacted with an ozone-containing solution. Next, the molding is treated with an alkali solution containing at least either an anionic surfactant or a nonionic surfactant and an alkali component. By the treatment with the acid or the organic solvent before the ozone treatment, the adhesive strength of a plating film in a region having a high residual internal stress is improved. COPYRIGHT: (C)2004,JPO