| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for semiconductor sealing having characteristics scarcely causing release from a semiconductor device in treatment with solder after water absorption to a lead frame oxidized when wire bonding, or the like, having little crack and excellent in soldering resistance, and to provide a semiconductor device. SOLUTION: The epoxy resin composition for semiconductor sealing comprises (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler and (E) a compound having reduction action as essential components. COPYRIGHT: (C)2004,JPO |
