| 摘要 |
A plurality of Liquid Metal Micro Switches (LIMMS) are mounted on opposite sides of a multi-layer substrate. Vias on the substrate and located within the footprints of the LIMMS serve to make connection with the LIMMS. Traces on the internal layers of the multi-layer substrate are routed around and over each other to arrive at a perimeter surrounding the LIMMS, where they emerge again as vias and are available for interconnection with further circuitry via conventional techniques, such as solder balls, wire bonding, a socket, etc. The multi-layer substrate may also incorporate a ground plane to assist in shielding and the fabrication of any interconnecting transmission lines.</PTEXT>
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