发明名称 Low defect density epitaxial wafer and a process for the preparation thereof
摘要 The present invention relates to an epitaxial wafer comprising single crystal silicon substrate and an epitaxial layer deposited thereon. The substrate comprises an axially symmetric region which is free of agglomerated intrinsic point defects and wherein silicon self-interstitials are the predominant intrinsic point defect in the axially symmetric region. The present invention further relates to a process for producing such an epitaxial wafer.</PTEXT>
申请公布号 US6632278(B2) 申请公布日期 2003.10.14
申请号 US20020135597 申请日期 2002.04.30
申请人 MEMC ELECTRONIC MATERIALS, INC. 发明人 FALSTER ROBERT A.;HOLZER JOSEPH C.;MARKGRAF STEVE A.;MUTTI PAOLO;MCQUAID SEAMUS A.;JOHNSON BAYARD K.
分类号 C30B29/06;C30B15/00;C30B15/14;C30B15/20;C30B15/22;C30B21/06;C30B27/02;C30B28/10;C30B30/04;C30B33/00;H01L21/322;H01L21/324;(IPC1-7):C30B29/06;C30B25/00 主分类号 C30B29/06
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