| 摘要 |
PROBLEM TO BE SOLVED: To prevent the defective soldering caused by crack and to reduce a post-correcting man-hour for the defective soldering by promoting solidifying of the internal part of the soldered part, in a soldering apparatus for cooling a printed board by a cooling fan after soldering with a lead-free solder consisting essentially of tin and copper. SOLUTION: The lead-free solder consisting essentially of tin and copper is soldered on the printed board 1 in a solder vessel 6, and the printed board 1 is cooled by a fan 7 for cooling the surfaces of parts just after completing the soldering. The surface 1a side of the parts on the printed board 1 is cooled with cold blast generated by the fan 7 for cooling the surfaces 1a of the parts. COPYRIGHT: (C)2004,JPO |
