| 摘要 |
PROBLEM TO BE SOLVED: To provide a joining structure of an electronic circuit device having a high effect of suppressing the diffusion of an Ni electrode material formed by an electroless plating process, capable of assuring the reliability of joining and permitting joining at a low temperature as well. SOLUTION: The junctions of the joining structure of the electronic circuit device in which connecting electrodes on a circuit board and connecting terminal electrodes on the electronic parts packaged to the board are electrically connected by Sn solder are formed of the solder containing 30 to 60 wt.% Bi, 0.5 to 2 wt.% Cu, and 0.1 to 2 wt.% Zn in addition to Sn. The solder can further contain 0.5 to 3 wt.% Ag as well. COPYRIGHT: (C)2004,JPO
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