| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and device for treating a substrate, wherein a transfer which is an index of unevenness in the thickness of a resist film and fluctuations in the line width of circuit pattern is prevented. SOLUTION: For an exposure process and development process with a substrate on which a resist liquid is coated, a resist liquid is coated on a substrate G, and then the substrate G is substantially dried under no-heating and is then dried under heat. As a specific example, an inert gas. Is blown on the substrate G from a showerhead 82 and the resist liquid coated on the substrate G is dried. |
