| 摘要 |
A semiconductor device is comprised of: an element isolating film formed on one major surface of a semiconductor substrate; an element forming region formed on the major surface and surrounded by the element isolating film; a gate electrode formed via a gate insulating film on the element forming region and extended over the element isolating film; first and second impurity regions formed in the element forming region, whose portions exposed from a surface of the semiconductor substrate are made in contact with the element isolating film and are located opposite to each other under the gate electrode; a first insulating film formed near the gate electrode on the first impurity region, and extended over the gate electrode and near an extended portion of the gate electrode within the element isolating film; and a second insulating film formed near the gate electrode on the second impurity region. In this semiconductor device, a distance defined from an outer edge of the gate electrode on the side of the first impurity region to another outer edge of the first insulating film on the side apart from the gate electrode is longer than a distance defined from an outer edge of the gate electrode on the side of the second impurity region to another outer edge of the second insulating film on the side apart from the gate electrode.</PTEXT>
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