| 摘要 |
A required interlayer circuit board <HIL><PDAT>1 </BOLD><PDAT>is constituted so as to provide a punched portion in which only a collapsible cable portion <HIL><PDAT>2 </BOLD><PDAT>for connecting a plurality of component mounting portions to each other is exposed. An external layer board <HIL><PDAT>6 </BOLD><PDAT>is superimposed on at least one side of the internal layer circuit board <HIL><PDAT>1 </BOLD><PDAT>through an adhesive member <HIL><PDAT>4 </BOLD><PDAT>to which an opening portion <HIL><PDAT>5 </BOLD><PDAT>is formed at a position corresponding to the cable portion <HIL><PDAT>2</BOLD><PDAT>, the external layer substrate <HIL><PDAT>6 </BOLD><PDAT>having an opening portion <HIL><PDAT>7 </BOLD><PDAT>at a similar position. Thereafter, a wiring pattern for the component mounting portions is formed on the external layer board <HIL><PDAT>6</BOLD><PDAT>, and a blank and pierce process of the respective component mounting portions except the cable portion is carried out, thereby integrally connecting a plurality of the component mounting portions to each other through the collapsible cable portion.</PTEXT>
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