| 摘要 |
PROBLEM TO BE SOLVED: To provide a wire cutting method for any object to be cut, a cutting wire and a manufacturing method for the wire, capable of enhancing the cutting efficiency and accuracy of the object and suppressing generation of a wire severance. SOLUTION: If the surface of the wire 11a is roughened to a certain degree or more, the retaining force of free abrasive grains b to the wire surface is heightened, and the amount of attachment of the free abrasive grains b to the wire surface is increased. Therefore, the cutting efficiency and accuracy are enhanced when cutting an ingot I by the wire 11a whereto a large quantity of the free abrasive grains b are attached. This suppresses unevenness of the wafer thickness and a warp of each wafer and also suppresses generation of the wire severance. COPYRIGHT: (C)2004,JPO |
