发明名称 FLOW SOLDERING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a method for suppressing the production amount of oxides of melt solder in a flow soldering apparatus. SOLUTION: A box 14 for cutting off air is provided at the portion of a drive shaft 12 to rotate a rotary blade 13 for solder transfer by a pressure for generating a jet flow is provided in a solder tank 5 for soldering by the flow soldering apparatus. The production amount of oxides of the melt solder is suppressed by making the rotating part of the drive shaft not come into contact with the surface of the melt solder. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003290916(A) 申请公布日期 2003.10.14
申请号 JP20020104751 申请日期 2002.04.08
申请人 CANON INC 发明人 SATOMI KUNIO
分类号 B23K3/06;B23K1/08;B23K101/42;H05K3/34;(IPC1-7):B23K1/08 主分类号 B23K3/06
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