发明名称 BASE MATERIAL LAYER LAMINATE AND PART USING THE LAMINATE
摘要 PROBLEM TO BE SOLVED: To provide a base material layer laminate in which base material layers and conductive layers are laminated without using a high temperature process, and a part using the laminate. SOLUTION: In the base material layer laminate 30, the base material layers 24 and the conductive layers 22 are laminated alternately. The conductive layer is formed by using a conductive layer forming means by electric plating, etc., in a clearance formed by the base material layers 24, each having the thin conductive layer 22 on at least one side, so that the base material layers are bonded and fixed to obtain the laminate 30. The laminate 30 is used in the part such as a capacitor. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003291237(A) 申请公布日期 2003.10.14
申请号 JP20020095855 申请日期 2002.03.29
申请人 TOYO KOHAN CO LTD 发明人 SAIJO KINJI;KAWAMURA TSUGIO;YOSHIDA KAZUO;OSAWA SHINJI
分类号 B32B7/02;(IPC1-7):B32B7/02 主分类号 B32B7/02
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