发明名称 Method and apparatus for mounting electronic device
摘要 A part mounting apparatus mounts a part, such as a film electronic part, accurately and efficiently on a substrate, such as a glass substrate. A measuring device (<HIL><PDAT>21</BOLD><PDAT>) moves along the edges of a glass substrate (<HIL><PDAT>31</BOLD><PDAT>) and measures the distance between the measuring device (<HIL><PDAT>21</BOLD><PDAT>) and the glass substrate (<HIL><PDAT>31</BOLD><PDAT>) at predetermined positions. The measuring device (<HIL><PDAT>21</BOLD><PDAT>) gives measured data to a controller (<HIL><PDAT>22</BOLD><PDAT>). The controller (<HIL><PDAT>22</BOLD><PDAT>) determines the state of deformation of the glass substrate (<HIL><PDAT>31</BOLD><PDAT>) on the basis of the measured data and controls suctions to be applied by suction pads (<HIL><PDAT>12</BOLD><PDAT>) included in a substrate conveying unit (<HIL><PDAT>10</BOLD><PDAT>) to the glass substrate (<HIL><PDAT>31</BOLD><PDAT>) on the basis of the measured data. The glass substrate (<HIL><PDAT>31</BOLD><PDAT>) being conveyed by the substrate conveying unit (<HIL><PDAT>10</BOLD><PDAT>) receives downward suctions of the suction pads (<HIL><PDAT>12</BOLD><PDAT>) and upward reaction forces of props (<HIL><PDAT>13</BOLD><PDAT>). The surface of the glass substrate (<HIL><PDAT>31</BOLD><PDAT>) can be brought to a level by thus correcting local warps in the glass substrate (<HIL><PDAT>31</BOLD><PDAT>) and the glass substrate (<HIL><PDAT>31</BOLD><PDAT>) can be held at a level corresponding to that of the upper ends of the props (<HIL><PDAT>13</BOLD><PDAT>).</PTEXT>
申请公布号 US6631557(B2) 申请公布日期 2003.10.14
申请号 US20010926238 申请日期 2001.09.28
申请人 SHIBAURA MECHATRONICS CORPORATION 发明人 OGIMOTO SHINICHI
分类号 H05K13/00;H05K13/08;(IPC1-7):H05K3/30 主分类号 H05K13/00
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