发明名称 Positive resist composition
摘要 A positive resist composition which comprises (A) a compound which generates an acid upon irradiation with an actinic ray or radiation, and (B) a resin which is decomposed by the action of an acid to increase solubility in an alkaline developing solution and contains repeating units represented by formulae (I) and (V):
申请公布号 US6632586(B1) 申请公布日期 2003.10.14
申请号 US19990392588 申请日期 1999.09.09
申请人 FUJI PHOTO FILM CO., LTD. 发明人 AOAI TOSHIAKI;SATO KENICHIRO
分类号 H01L21/027;C08F8/14;C08F20/10;C08L101/02;C09D201/02;G03F7/004;G03F7/039;(IPC1-7):G03C1/72;G03C1/73 主分类号 H01L21/027
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