| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming an ink channel substrate without lowering the work efficiency in a process for making a through hole through the ink channel substrate by etching only the outer circumference of the through hole. SOLUTION: When a silicon wafer for forming an ink channel substrate, a main component of an ink jet head, is dry etched and a through hole, i.e., an alignment reference hole, and a common ink chamber are formed by etching only the outer circumference of the through hole, the silicon wafer is coupled through a rib with unnecessary silicon produced through etching only of the outer circumference so that unnecessary silicon does not fall from the silicon wafer. Since unnecessary silicon is not left in the chamber of a dry etching system, the labor required for removing unnecessary silicon from the chamber for each wafer is saved and an ink channel substrate can be formed without lowering the work efficiency. COPYRIGHT: (C)2004,JPO
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