| 发明名称 |
Chemical-mechanical planarization of metallurgy |
| 摘要 |
Copper or a copper alloy is removed by chemical-mechanical planarization (CMP) in a slurry of an oxidizer, an oxidation inhibitor, and an additive that appreciably regulates copper complexing with the oxidation inhibitor.</PTEXT>
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| 申请公布号 |
US6632377(B1) |
申请公布日期 |
2003.10.14 |
| 申请号 |
US19990409798 |
申请日期 |
1999.09.30 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BRUSIC VLASTA;EDELSTEIN DANIEL C.;FEENEY PAUL M.;GUTHRIE WILLIAM;JASO MARK;KAUFMAN FRANK B.;LUSTIG NAFTALI;ROPER PETER;RODBELL KENNETH;THOMPSON DAVID B. |
| 分类号 |
B24C11/00;C09G1/02;C09K13/04;C23F3/00;H01L21/321;(IPC1-7):C09K13/00;C09K13/06;H01L21/302 |
主分类号 |
B24C11/00 |
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